Intel's 2020 Highlights Showcase AI, Autonomous Driving, and Chip Innovation
Intel's 2020 news archive highlights a year of significant advancements in artificial intelligence, autonomous vehicles through Mobileye, and cutting-edge chip technologies like EUV and Foveros 3D stacking.
Intel kicks off 2020 by showcasing a wide array of intelligent technologies at CES, spanning the cloud, network, edge, and PC. The company highlights its upcoming extreme ultraviolet (EUV) lithography technology and introduces innovative hardware like the Lakefield chip, which utilizes award-winning Foveros 3D stacking technology. Alongside these hardware leaps, Intel demonstrates its commitment to high-performance computing by building 10 million QLC 3D NAND solid-state drives and pushing processor limits in its overclocking lab.
Artificial intelligence serves as a major focal point throughout the year's early developments. Intel partners with the American Red Cross to leverage AI for disaster preparedness and generate open source maps for relief efforts. The tech giant also applies its AI capabilities to unique conservation projects, counting Antarctic penguins and powering the TrailGuard AI anti-poaching solution in Kenya. Additionally, Intel collaborates with Atos and HLRN to advance critical research in earth sciences, fluid dynamics, and healthcare.
Mobileye, Intel's autonomous driving subsidiary, expands its global footprint significantly with new deals in China and South Korea. The company demonstrates the reliability of its camera-driven autonomous vehicles and achieves real-world safety improvements, such as lowering collision rates for the Seman-Tov school bus fleet. Beyond automotive tech, Intel explores new commercial frontiers by partnering with Sinclair Holdings to build the first all-digital hotel and teaming up with AREA15 to bring experiential retail to life in Las Vegas.