NVIDIA and TSMC Unveil First Blackwell AI Wafer Made in America
NVIDIA and TSMC celebrate the first Blackwell wafer produced at TSMC's Arizona facility, marking a major step in onshoring advanced AI chip manufacturing. This milestone signals the start of volume production for the highly anticipated architecture.
NVIDIA and TSMC celebrate a major manufacturing milestone as they unveil the first NVIDIA Blackwell wafer produced on U.S. soil at TSMC's Phoenix facility. This achievement confirms that the Blackwell architecture officially reaches volume production in America. NVIDIA CEO Jensen Huang and TSMC executives gather at the Arizona plant to sign the historic wafer and highlight the domestic construction of the world's AI infrastructure.
Huang calls the event a historic moment, noting it is the first time in recent American history that the world's most important chip is manufactured domestically by an advanced fab. He frames the milestone as a realization of reindustrialization efforts aimed at bringing vital technology manufacturing back to America. TSMC Arizona CEO Ray Chuang credits three decades of partnership with NVIDIA and the dedication of local employees for making this rapid progress possible.
The newly produced wafer undergoes a complex process of layering, patterning, etching, and dicing before it becomes a finished Blackwell AI chip. Moving forward, TSMC Arizona plans to produce a range of advanced technologies, including two-, three-, and four-nanometer chips. This domestic production capability significantly bolsters the U.S. supply chain and secures American leadership in the global AI era.