Nvidia Delays Next-Gen Blackwell GPUs Into 2025 Due to Packaging Snags
Nvidia is pushing back shipments of its highly anticipated Blackwell GPUs to early 2025 because of manufacturing complexities with TSMC's advanced CoWoS-L packaging technology.
Nvidia reportedly delays shipments of its next-generation Blackwell GPUs until the first quarter of 2025 due to manufacturing issues. The GPU giant recently informs Microsoft and other major customers that the most advanced models in the Blackwell family face significant setbacks. This disruption affects tech giants like Microsoft and Meta, which place multi-billion dollar orders for these chips to power their growing AI services.
The root cause of the delay stems from the physical design complexity of the Blackwell chips. According to semiconductor research firm SemiAnalysis, Blackwell represents the first high-volume design to utilize TSMC's CoWoS-L packaging technology. This advanced method uses an organic interposer with embedded local silicon interconnects and bridge dies to route signals between chiplets, making it significantly more complex than previous packaging methods.
Because of these production hurdles, Nvidia may have to cancel or postpone certain products to prioritize its highest-priority silicon. Volume shipments of flagship chips like the Blackwell B200 slip by at least three months, temporarily disrupting customer roadmaps. However, industry analysts suggest this manufacturing bottleneck is unlikely to hurt Nvidia's long-term market position as demand for AI hardware continues to soar.